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Prototype '3D' chip from MIT could eliminate memory bottlenecks | Engadget
Advanced Packaging Part 3 – Intel's Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape
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Interview with Sergei Chapek: The Design of 3D Printed Micro Fluidics
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Rumor: Amazon working on two smartphones, one with a 3D user interface - Liliputing
GlobalFoundries and Arm are Boosting Processor Interconnections via 3D Chip Integration | Maker Pro
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Intel unveils a groundbreaking way to make 3D chips | Engadget
Amazon SageMaker Ground Truth can now create virtual objects for AI model training | TechCrunch
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3D Printing of Medicines: Engineering Novel Oral Devices with Unique Design and Drug Release Characteristics | Molecular Pharmaceutics
Amazon.com: Voxelab New Upgrade 32-bit Motherboard Silent Mainboard for Aquila/Aquila x2, 3D Printer Accessories Controller Board (N32 Chip) : Industrial & Scientific
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Barry Schwartz on Twitter: "Google has removed the 3D and AR Early Adopters Program https://t.co/f3CfPnOHt3 https://t.co/kNEwLkX3hX" / Twitter
Advanced Packaging Part 2 - Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia
MCA | Free Full-Text | Geometric Modeling and 3D Printing Using Recursively Generated Point Cloud
IBM, Tokyo Electron Announce 3D Chip Stacking Breakthrough
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems: Elfadel, Ibrahim (Abe) M., Fettweis, Gerhard: 9783319204802: Amazon.com: Books